| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an exposure device and an exposure method which can always expose in the best circumstances by detecting a foreign matter on a wafer chuck so as to prevent conditions such as cleaning is carried out although the foreign matter does not exist on the wafer chuck or such as exposure is started although the foreign matter remains on the wafer chuck. <P>SOLUTION: In the exposure device that exposes the pattern of a reticle substrate onto a semiconductor wafer via a projection optical system, the wafer chuck 5 that the exposure device holds the semiconductor wafer and a wafer stage 6 for supporting the wafer chuck 5 are provided. The presence of the foreign matter 9 on the wafer chuck 5 is detected by an off-axis scope, a comparison mechanism 11 or the like used for a foreign matter detecting means before mounting the semiconductor wafer on the wafer chuck 5. <P>COPYRIGHT: (C)2003,JPO</p> |
