| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor treatment apparatus which achieves low cost, small foot print, small face print, stable treatment and high throughput. SOLUTION: Operation costs, foot print and face print are reduced and the throughput and stability are improved in the semiconductor treatment apparatus. Except for the period of vacuum deposition, atmospheres of both a reaction chamber and a transfer chamber are evacuated by using a transfer chamber evacuation port arranged below the surface of the semiconductor wafer. This constitution prevents particles generated during wafer transfer or vapor evaporation from sticking to the surface of the semiconductor wafer. By additionally introducing purge gas into the transfer chamber during vapor deposition and using a discrete insulation plate, the atmospheres of the reaction and of the transfer chamber are separated effectively from each other, so that vapor evaporation onto the wall and component of the transfer chamber is prevented. COPYRIGHT: (C)2003,JPO |
