发明名称 CLEANING GAS AND ETCHING GAS
摘要 <p><P>PROBLEM TO BE SOLVED: To obtain chamber cleaning gas and etching gas for a silicon containing film each containing perfluorocyclic ether having not less than two and not more than four oxygen atoms ether bonded to a carbon atom. <P>SOLUTION: The chamber cleaning gas and the etching gas for a silicon containing film are environmentally friend because they do not produce exhaust gas harmful to the environment, i.e., CF<SB>4</SB>, causing global warming. They are easy-to-handle nontoxic gas or volatile liquid and exhibit excellent exhaust gas treatment performance. The chamber cleaning gas also exhibits an excellent cleaning rate. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003234299(A) 申请公布日期 2003.08.22
申请号 JP20020034460 申请日期 2002.02.12
申请人 RESEARCH INSTITUTE OF INNOVATIVE TECHNOLOGY FOR THE EARTH;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY 发明人 OHIRA YUTAKA;MITSUI YUUKI;YONEMURA TAISUKE;SEKIYA AKIRA
分类号 B08B7/00;C09K13/00;C09K13/08;C23C16/44;H01L21/205;H01L21/306;H01L21/3065;H01L21/311;(IPC1-7):H01L21/205 主分类号 B08B7/00
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