| 摘要 |
PROBLEM TO BE SOLVED: To improve a treating capacity of a device by executing pretreatment of the electrode surface of a wafer not by a probing device but by a probe card. SOLUTION: One ends of a card needle 2 having elasticity of this probe card and a truss needle 3 for changing the intensity thereof are planted on needle mounting parts, and the other ends thereof are used as free ends, and the other end of the truss needle 3 is directed in the card needle 2 direction. When the tip of the card needle 2 is slid in the lateral direction on the surface of a pad, the tip part of the truss needle 3 supports a prescribed position on the middle part of the card needle 2, and thereby the tip of the card needle 2 performs a reciprocating motion on the surface of the pad. COPYRIGHT: (C)2003,JPO
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