| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component hard to cause pressure strain during temporary pressing and hard to cause a defect such as interlayer separation on a laminated ceramic chip due to an impact by a cutting blade even when the number of laminations of a ceramic laminated blocks is large. SOLUTION: The manufacturing process is provided with; a process for printing an inside electrode on the surface of a ceramic green sheet; a temporary pressing process for overlaying and pressing a plurality of the ceramic green sheets; a pressing process for pressing a temporarily pressed ceramic laminated block; and a cutting process for cutting the ceramic laminated block in accordance with arrangement of the inside electrode and cutting out the laminated ceramic chip. In the temporary pressing process as shown on a full line P1 and a dashed line P4, pressing is performed each time the ceramic green sheet is overlaid, and as the number of overlays thereof is increased and temporary pressing pressure is reduced. COPYRIGHT: (C)2003,JPO
|
