发明名称 ELECTRONIC COMPONENT WITH LEAD WIRE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component with a lead wire for suppressing cracks of an external surface covering resin when inserted into a through hole of a printed circuit board or the like and hard to cause peeling or the like of a joined part of an electronic component body and a lead terminal. SOLUTION: The electronic component with the lead is so constituted that first to third lead terminals 3-5 are connected to a piezoelectric resonator 2 as the electronic component body, and the piezoelectric resonator 2 is covered with the external surface covering resin 7. The ends of inclined edges 3d, 3e, 5d and 5e of waist portions 3c and 5c of the first and third lead terminals 3 and 5 at both the sides of the component are higher than those of inclined edges 4e and 4d of a waist portion 4c of the second central lead terminal 4. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003234237(A) 申请公布日期 2003.08.22
申请号 JP20020029888 申请日期 2002.02.06
申请人 MURATA MFG CO LTD 发明人 HOSOKAWA TETSUO;IKEDA YOSHIHIRO
分类号 H01G2/06;H03H9/02;H03H9/13;(IPC1-7):H01G2/06 主分类号 H01G2/06
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