发明名称 CONDUCTIVE COMPOUND
摘要 PROBLEM TO BE SOLVED: To provide a conductive compound which enables high joining strength at a joining interface and enables high electric reliability at the joining interface even under severe environmental conditions such as temperature changes or vibrations. SOLUTION: The conductive compound comprises metal powder which consists of silver particles whose diameters are 0.5 to 60μm and tin particles whose diameters are 0.5 to 60μm, and dispersion medium wherein the tin particles have ball shapes. The metal powder of 85 to 93 wt.% is contained in the electrically conductive compound, the silver particles and the tin particles are mixed in the wt. radio of 75 to 50:25 to 50, and single or mixed solvent having boiling temperature of 200°C or more is chosen from polyhydric alcohol, hydrocarbon or alcohol ester as the dispersion medium. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003234016(A) 申请公布日期 2003.08.22
申请号 JP20020029944 申请日期 2002.02.06
申请人 DENSO CORP;FUKUDA METAL FOIL & POWDER CO LTD 发明人 MORIMOTO HIROSHI;KOMATSU MICHIO;YAZAKI YOSHITARO;SHIRAISHI YOSHIHIKO;KONDO KOJI;HARADA TOSHIICHI;YOKOCHI TOMOHIRO
分类号 C08K3/08;C08K5/01;C08K5/053;C08K5/10;C08L101/00;C09D5/24;C09D201/00;H01B1/22;(IPC1-7):H01B1/22 主分类号 C08K3/08
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