| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component incorporated with a guidance micro component disposed on a substrate. <P>SOLUTION: This component includes continuous layers (10, 10a) of a substance with a low relative dielectric constant, which are isolated by a hard mask layer (12) and lie on the upper surface of a substrate (1), a multiplicity of metallic bent portions (30-31) defined on the continuous layers (10, 10a) of a substance with a low relative dielectric constant, and a copper-diffused barrier layer (15) sandwiched between the metallic bent portions (30-31) and the layers of a substance with a low relative dielectric constant, which is disposed immediately under this layer. The substrate (1) is a semiconductor substrate, or a glass or quartz-type amorphous substrate for forming an integrated circuit. The substance with a low relative dielectric constant deposited on the substrate (1) is preferably benzocyclobutene. <P>COPYRIGHT: (C)2003,JPO</p> |
