SYSTEM AND METHOD OF MECHANICALLY PLANARIZING SEQUENTIAL BUILDUP BOARD FOR INTEGRATED CIRCUIT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a system and a method of mechanically planarizing a sequential buildup board for integrated circuit packages.

SOLUTION: A planarizing plate is settled in contact with a ununiform outer surface of a dielectric layer covering underlying functional circuit elements and filler circuit elements. A heating element on the planarizing plate planarizes protrusive portions of the outer surface of the dielectric layer to form a flat outer surface on the dielectric layer. After cooling the flat outer surface of the dielectric layer, it is covered with a metal conductor layer. This method increases the number of sequential buildup layers capable of being laid on a sequential buildup board.

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