PREHEATER FOR DIP UNIT AND PREHEATING UNIT

摘要

PROBLEM TO BE SOLVED: To provide a preheater for a DIP unit in which possibility of bringing about a damage or a functional decrease in a surface mounting type electronic component is reduced to perform the partial DIP on a board to be mounted with the surface mounting type component and an electronic component with legs in mixture and without bringing about a complication of a work. SOLUTION: The preheater 30 for the DIP unit is used for the DIP unit for partially performing the DIP to solder-clamp the electronic component with the legs at a predetermined position of the board 10 in which the surface mounting type electronic component is mounted. The preheater 30 warms a position to be at least partly performed by the DIP. COPYRIGHT: (C)2003,JPO