| 摘要 |
PROBLEM TO BE SOLVED: To simply and inexpensively perform solid phase connection of electrodes as for a method for connecting the electrodes which connects the electrodes by solid-phase-connecting, an electrode activating apparatus, and an electrode surface activating apparatus. SOLUTION: The method for connecting the electrodes which connects component-side electrodes 12 formed on an electronic component 10 with board- side electrodes 22 formed on a circuit board 20 activates connecting surfaces 12a and 22a of the component-side electrodes 12 and the board-side electrodes 22, coats respective electrodes 12 and 22 having these connecting surfaces 12a and 22a activated with adhesive films 30A and 30B for maintaining activated states of the respective electrodes 12 and 22, and thereafter pressure-welds the respective electrodes 12 and 22, to break through the adhesive films 30A and 30B to solid-phase-connect the component-side electrodes 12 and the board- side electrodes 22. COPYRIGHT: (C)2003,JPO
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