METHOD FOR DICING WAFER STACK FOR ACCESSING INTERIOR STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a system and method pertaining to a wafer stack that needs the dicing of the wafer stack in order to provide an access to an interior structure and/or component of the wafer stack. SOLUTION: A method for dicing the wafer stack is provided. In a preferred embodiment, the method includes steps of (1) providing a wafer stack having a first wafer and a second wafer; (2) exposing a portion of the first wafer by removing a portion of the second wafer; and (3) dicing the exposed portion of the first wafer such that a first die assembly is at least partially separated from the wafer stack. The wafer stack and die assembly are also provided. COPYRIGHT: (C)2003,JPO