| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a board made of resin in which the warpage of the board can be suppressed in the board having a solder bump. SOLUTION: The method for manufacturing the board 101 made of the resin comprises a solder bump forming step of heating a board body 111 in which solder paste is put on the main surface 112 of the board to melt the solder, and forming a solder bump 123. In this step, the body 111 in which the solder bump is mounted is heated in a state that the peripheral edge 121 of the body 111 is inserted into a groove HJM of a holding jig HJ by using the jig HJ having a groove HJM in which the peripheral edge 121 can be inserted along the peripheral edge 121 of the body 111 to suppress the occurrence of warpage in the body 111. COPYRIGHT: (C)2003,JPO
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