| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection probe substrate having no projections formed on a pad or no exfoliation of the pad even when the pad or a wiring pattern is fine, and its manufacturing method. SOLUTION: A roughened part 18 is formed on the pad 7 surface in contact with a conductive projection 8, to thereby improve adhesion between the pad 7 and the conductive projection 8. Since wiring 3 is formed by etching after applying roughening treatment to the whole surface of a copper foil 1, the fine wiring 3 can be formed and the adhesion between the conductive projection 8 and the pad 7 is improved. COPYRIGHT: (C)2003,JPO
|
