发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board wherein the current capacity of each conductor can be increased easily, in response to the magnitude of the current flowing in each conductor pattern of its circuit, and the using conditions of each conductor pattern can be satisfied. SOLUTION: Two soldering portions 6 are so provided respectively in a conductor pattern 3, formed on an insulation board 2 as to attach thereto the two terminal portions of a copper plate 5 having a predetermined thickness by soldering. The copper plate 5 has a nearly equal shape to the one of the conductor pattern 3, that the copper plate 5 is provided on the conductor pattern 3 and overlaps with it in a region of the conductor pattern 3, when the copper plate 5 is subjected to the surface mounting on the conductor pattern 3. Also, the copper plate 5 used has a thickness such that the necessary current capacity of a conductor can be secured, in response to the current quantity flowing in a circuit. Since the shapes of the copper plate 5 and the conductor pattern 3 are nearly equal to each other, the paths of the currents flowing in them can be made nearly similar to each other so as to make improvable their noise radiating characteristics. Further, since the copper plate 5 is fastened to the conductor pattern 3 by soldering, the attaching/detaching of the copper plate 5 to/from the conductor pattern 3 can be made easily. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003234548(A) 申请公布日期 2003.08.22
申请号 JP20020030790 申请日期 2002.02.07
申请人 MINEBEA CO LTD 发明人 SHINTAKU KAZUHIRO
分类号 H05K1/09;H05K1/02;H05K3/24;(IPC1-7):H05K1/02 主分类号 H05K1/09
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