| 摘要 |
PROBLEM TO BE SOLVED: To provide black composite particle powder for a semiconductor sealing material having excellent humidity resistance, blackness, fluidity, tinting strength, and dispersibility into a binding agent, and a semiconductor sealing material having an excellent volume specific resistance value, blackness, humidity resistance, fluidity and flexural strength. SOLUTION: The black composite particle powder for the semiconductor sealing material comprises black composite particle powder in which the surface of an extender particle is coated with carbon black, wherein the deposit of the carbon black is 1-100 weight parts against 100 weight parts of the extender. It also comprises complex particle powder in which the surface of an extender particle is coated with a paste material, and an average size of the particles of black pigment adhered to the coating is 0.005-30.0μm, wherein the deposit of the black pigment is 1-10 weight parts against 100 weight parts of the extender. The semiconductor sealing material comprises the black complex particle powder for the semiconductor sealing material and a binder resin. COPYRIGHT: (C)2003,JPO
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