发明名称 ELECTRICAL CONNECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To facilitate the exchange of a probe in spite of being capable of preventing the come-out of the probe from a substrate. SOLUTION: This electrical connection apparatus comprises an electrically insulating substrate, a plurality of pipes mounted to the substrate in a state of passing through the substrate in its thickness direction, and a plurality of probes arranged so as to correspond to individual pipes. Each probe passes through the corresponding pipe and is fixed to at least one end of the corresponding pipe. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003234385(A) 申请公布日期 2003.08.22
申请号 JP20020034234 申请日期 2002.02.12
申请人 MICRONICS JAPAN CO LTD 发明人 SUGIYAMA TADASHI;MIZUKI YOSHIO;OGASAWARA TERUZO;ASO HIROYUKI
分类号 G01R31/26;G01R1/073;G01R31/28;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/26
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