发明名称 |
CHIP TYPE ELECTROLYTIC CAPACITOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a chip type electrolytic capacitor with junction strength retained unchanged between the capacitor element and the positive and negative terminal boards under the expansion of sealing resin during a thermal process for mounting. SOLUTION: In the chip type electrolytic capacitor; a capacitor element has a column type positive electrode lead wire serving as a positive electrode and a negative electrode layer covering the positive electrode lead wire and serving as the negative electrode; a positive electrode terminal board is connected to the protruded positive electrode and a negative electrode terminal board is connected with the capacitor element with facing down thereto, and the terminal boards are sealed with a sealing resin; and the surfaces of the terminal boards are exposed flush with each other on the same surface of the sealing resin. It is characterized in that at least one of the two terminal boards has an engagement section to engage the sealing resin. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003234251(A) |
申请公布日期 |
2003.08.22 |
申请号 |
JP20020031468 |
申请日期 |
2002.02.07 |
申请人 |
NEC TOKIN CORP;NEC TOKIN TOYAMA LTD |
发明人 |
SANO MITSUNORI;MUKONO SETSU;TAKADA KAZUSHI |
分类号 |
H01G9/08;H01G9/004;(IPC1-7):H01G9/004 |
主分类号 |
H01G9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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