发明名称 |
Wire bond package with core ring formed over I/O cells |
摘要 |
A wire bond package for an integrated circuit die includes a first I/O core ring and a second I/O core ring formed in a first metal layer; a pad strap formed in a second metal layer overlapping the second I/O core ring; a via formed between the first metal layer and the second metal layer where the second I/O core ring and the pad strap overlap; a first core ring formed in a third metal layer overlapping the first I/O core ring; a via formed between the first metal layer and the third metal layer where the first I/O core ring and the first core ring overlap outside the power strap; a first power mesh formed in a fourth metal layer overlapping the first core ring; and a via formed between the third metal layer and the fourth metal layer where the first core ring and the first power mesh overlap.
|
申请公布号 |
US2003155633(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20020082027 |
申请日期 |
2002.02.20 |
申请人 |
RATCHKOV RADOSLAV |
发明人 |
RATCHKOV RADOSLAV |
分类号 |
H01L23/485;H01L23/50;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L23/485 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|