| 摘要 |
<p>A method for repairing a fine pattern capable of preventing a substrate from cracking and then breaking when a solid state metallic film is formed by heating a liquid coating. A high-thermal-conductivity plate or a thermal-insulation layer is abutted against the rear surface of a substrate having a coating of liquid material containing a metal formed on a defective part of a fine pattern formed on the surface and then the surface of the substrate is heated to form a solid state coating, thus repairing the fine pattern. Alternatively, rear surface of the substrate is heated to form a solid state coating, thus repairing the fine pattern. According to the method, the substrate is not cracked nor broken.</p> |
