发明名称 |
Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device |
摘要 |
A method for manufacturing an electronic component includes forming an aggregate electronic component including a plurality of electronic components and dividing the aggregate electronic component to separate the plurality of electronic components to form individual electronic components. Through-holes are formed in a laminated body providing an aggregate electronic component wherein via-hole conductors are arranged so as not pass through the aggregate electronic component in a thickness direction thereof, the via-hole conductors are divided by the through-holes, and each divided portion provides an external terminal electrode. Then, by dividing the laminated body along the dividing lines passing through the through-holes, a plurality of individual electronic components are produced.
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申请公布号 |
US2003157749(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20030400026 |
申请日期 |
2003.03.26 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SAKAI NORIO;IIDA KAZUHIRO |
分类号 |
H01G4/12;H01G4/228;H01G4/30;H01L23/12;H01L23/498;H05K1/02;H05K1/03;H05K1/18;H05K3/00;H05K3/34;H05K3/40;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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