PROCESSING SUBSTRATE AND/OR SUPPORT SURFACE AND METHOD OF MANUFACTURE THEREOF

摘要

A processing substrate comprises a first cut-resistant layer having a first surface area and including a first absorbent ply and a thermoplastic material ply. The processing substrate further includes a second layer having a second surface area and including a second absorbent ply and a thermoplastic material ply, wherein the first layer is secured to the second layer such that a portion of the second surface area is laterally disposed outside of the first surface area.