发明名称 |
ARRANGEMENT FOR WIRE BONDING AND METHOD FOR PRODUCING A BONDING CONNECTION |
摘要 |
The invention relates to a method for wire bonding and a method for the production of a bonding connection. A bonding point (2, 20) is heated by means of a laser beam (4) originating from a laser. The arrangement (1) comprises a wedge-wedge-ultrasound-bonding device with a bonding needle (5), a copper or aluminium bonding wire guide (7) and a copper or aluminium wire (8) for a wedge-wedge-ultrasound-bonding method and at least one of the bonding points (2, 20) displays a hard metal covering (6). |
申请公布号 |
WO03068445(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
WO2003DE00325 |
申请日期 |
2003.02.05 |
申请人 |
INFINEON TECHNOLOGIES AG;HOSSEINI, KHALIL |
发明人 |
HOSSEINI, KHALIL |
分类号 |
B23K20/00;B23K20/10;B23K26/20 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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