METHOD FOR MANUFACTURING ULTRA-THIN TYPE BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A method for manufacturing an ultra-thin type BGA(Ball Grid Array) package is provided to be capable of reducing the failure of the BGA package by polishing the BGA package completed with a molding process. CONSTITUTION: A tape substrate(120) is prepared, wherein the tape substrate is provided with a semiconductor chip(110) including an active surface having a plurality of bonding pads(114) and an inactive surface, an upper surface having a plurality of solder pads, a lower surface, and a through hole(123) formed to penetrating the upper and lower surface. The active surface of the semiconductor chip is attached on the lower surface. An electrical connecting part(130) is used for connecting the bonding pad and the upper surface. The first molding part(150a) is formed at the resultant structure. The thickness of the semiconductor chip is reduced by polishing the inactive surface of the semiconductor chip. An outer connecting part is connected to the solder pad.