ADVANCED AIR COOLED HEAT SINK

摘要

A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material includes alternating planar portions and curved portions has one edge abutted to the top surface such that the curved portions extend upwardly from the top surface substantially at a right angle. Each planar portion has a plurality of louvers formed therein wherein the louvers are substantially parallel one to the other and perpendicular to the base plate.