THICK FILM CONDUCTOR COMPOSITIONS FOR USE ON ALUMINUM NITRIDE SUBSTRATES
摘要
The invention is directed to a conductive thick film composition for use on an aluminum nitride substrate that utilizes a boron containing reactant and a metal oxide to promote adhesion.
申请公布号
WO03031373(A3)
申请公布日期
2003.08.21
申请号
WO2002US33469
申请日期
2002.10.08
申请人
E. I. DU PONT DE NEMOURS AND COMPANY;WANG, YUELI;CARROLL, ALAN, FREDERICK
