An artificial environment module (2) comprising: an outer casing (4) defining an inner environment (6) an inner casing (10) located in the inner environment and containing an optic chip (14) including at least a first portion defining a thermally-sensitive optic element a package sensor (20c) for monitoring the temperature of the inner casing a package temperature controller (16) for heating and/or cooling the inner casing in dependence on the temperature sensed by the package sensor to minimise variations in the temperature with respect to changes in ambient temperature, and whose operation in response to changes in ambient temperature does not induce stress in the optic chip an on-chip sensor for locally monitoring the temperature of the first portion of the optic chip and at least one local temperature controller (18) provided in thermal contact with the first portion of the optic chip for locally heating and/or cooling the first portion of the optic chip in dependence on the temperature measured by the on-chip sensor.
