| 摘要 |
<p>A semiconductor element, such as a pressure sensor, having an upper surface, so that a part of the upper surface is exposed to the outside, while this element is in use. The element is sealed with a sealing resin. The sealing resin has a second, upper surface and a recess, so that said part of the first, upper surface of the semiconductor element is exposed outside at the bottom of said recess which is opened at the second, upper second surface. A releasable protective member has a shape corresponding to the recess and is placed in the recess, so that, when said protective member is in the recess, a bottom surface thereof is in contact with the part of the first, upper face of the protective member and the upper face of the resin coincides with the second surface of the sealing resin.</p> |
