发明名称 |
Method and apparatus for testing a system-on-a-chip |
摘要 |
A method for testing a system on a chip or a system on a package (""SOPC") having a plurality of internal modules that are tested to determine whether predetermined performance specifications are satisfied. A first module of the SOPC is selected for testing. A determination is made as to whether the first module is directly accessible or not. If the first module is directly accessible, the module may be tested with automated test equipment external to the SOPC. If the first module is not directly accessible, the module may be tested with a second and third module of the SOPC.
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申请公布号 |
US2003158688(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20020280543 |
申请日期 |
2002.10.24 |
申请人 |
CHATTERJEE ABHIJIT;MAJERNIK DAVE;CHERUBAL SASIKUMAR;CHAKRABARTI SUDIP;VOORAKARANAM RAMAKRISHNA;ABRAHAM JACOB A.;GOODMAN DOUGLAS |
发明人 |
CHATTERJEE ABHIJIT;MAJERNIK DAVE;CHERUBAL SASIKUMAR;CHAKRABARTI SUDIP;VOORAKARANAM RAMAKRISHNA;ABRAHAM JACOB A.;GOODMAN DOUGLAS |
分类号 |
G01R31/3167;G01R31/3185;(IPC1-7):G06F19/00;G01R27/28;G01R31/00;G01R31/14 |
主分类号 |
G01R31/3167 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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