| 摘要 |
<p>The present invention relates to an adhesive and more particularly to a moisture curable adhesive. In one embodiment, the present invention includes a moisture curable adhesive contains a polymer including reactive silicon end groups, a catalyst and from about 3% to about 35% by weight diluent. The moisture curable adhesive composition exhibits improved tack and self-leveling properties at low viscosities less than about 10,000 centipoise. In another embodiment the moisture curable adhesive composition contains a polymer including reactive silicon end groups, a catalyst and up to about 40% by weight filler, based on the total weight of the adhesive composition. The moisture curable adhesive composition maintains clarity at high filler loading and has excellent UV resistance. Preferably, the filler is a fumed silica having a maximum surface area of less than about 250m2/g. In another embodiment, the moisture curable adhesive contains a polymer including a reactive silicon group and from about 40% to about 85% percent by weight filler and has a viscosity of less than about 500,000 centipoise. The present invention is further directed to a method of joining two adherends.</p> |
