发明名称 Anisotropically conductive film
摘要 An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.
申请公布号 US2003155656(A1) 申请公布日期 2003.08.21
申请号 US20030346288 申请日期 2003.01.17
申请人 CHIU CINDY CHIA-WEN;CHEN DAVID HSEIN-PIN;CHU PHILIP YI ZHI;CHUANG HSIAO KEN;BARKER H. PAUL 发明人 CHIU CINDY CHIA-WEN;CHEN DAVID HSEIN-PIN;CHU PHILIP YI ZHI;CHUANG HSIAO KEN;BARKER H. PAUL
分类号 H01L23/498;H05K3/32;(IPC1-7):H01L23/48 主分类号 H01L23/498
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