发明名称 |
Anisotropically conductive film |
摘要 |
An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.
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申请公布号 |
US2003155656(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20030346288 |
申请日期 |
2003.01.17 |
申请人 |
CHIU CINDY CHIA-WEN;CHEN DAVID HSEIN-PIN;CHU PHILIP YI ZHI;CHUANG HSIAO KEN;BARKER H. PAUL |
发明人 |
CHIU CINDY CHIA-WEN;CHEN DAVID HSEIN-PIN;CHU PHILIP YI ZHI;CHUANG HSIAO KEN;BARKER H. PAUL |
分类号 |
H01L23/498;H05K3/32;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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