发明名称 |
Thermally-conductive electrically-insulating polymer-base material |
摘要 |
An electrically-insulating polymer-based material with improved thermal conductivity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.
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申请公布号 |
US2003158294(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20020075978 |
申请日期 |
2002.02.15 |
申请人 |
CHAUDHURI ARUN K.;MYERS BRUCE A. |
发明人 |
CHAUDHURI ARUN K.;MYERS BRUCE A. |
分类号 |
C08K3/08;(IPC1-7):C08K9/00 |
主分类号 |
C08K3/08 |
代理机构 |
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地址 |
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