DEFLECTABLE MICROSTRUCTURE AND METHOD OF MANUFACTURING THE SAME THROUGH BONDING OF WAFERS

摘要

The invention relates to a method of making a deflectable, free hanging micro structure comprising at least one hinge member, the method comprising the steps of providing a first sacrificial wafer comprising a single crystalline material constituting material forming the micro structure. A second semiconductor wafer comprising necessary components for forming the structure in cooperation with said first wafer is provided. Finite areas of a structured bonding material is provided, on one or both of said wafers at selected locations, said finite areas defining points of connection for joining said wafers. The wafers are bonded using heat and optionally pressure. Sacrificial material is etched away from said sacrificial wafer, patterning the top wafer by lithography is performed to define the desired deflectable microstructures having hinges, and subsequently silicon etch to make the structures.