SOLDER PASTE FORMULATIONS, METHODS OF PRODUCTION AND USES THEREOF

摘要

A solder paste formulation has been developed that comprises a) at least one metal-based material; b) at least one support material; and c) at least one stability modification material. Furthermore, a method of producing a solder paste formulation having a stability component, as described herein, comprises a) providing at least one metal-based material; b) providing at least one support material; c) providing at least one stability modification material; and d) combining the at least one metal-based material, the at least one support material and the at least one stability modification material such that the stability component of the solder paste formulation is increased over a reference stability component of a conventional or reference solder paste formulation comprising similar metal-based materials and similar support materials.