Wiring board and soldering method therefor

摘要

A circuit board comprising a first solder leading land 13a disposed next to a mounting land located rearmost in a direction the circuit board moving during flow soldering of an electronic component, and a second solder leading land 13b disposed behind the first solder leading land 13a against the direction. The present invention provides a circuit board which can effectively prevent solder bridges caused by excessive solder accumulated around leads and lands located in the rearmost position while the electronic component is flow soldered at narrow pitches as is represented by a case with QFPIC. The circuit board of the present invention is suitable for use of lead-free solder, thus contributes to an environment protection.