发明名称 |
Electronic component and method of manufacturing same |
摘要 |
An electronic component is provided with a connection conductive layer containing a 0.05 weight percent to 1.5 weight percent of nickel in a Sn-Bi (tin-bismuth) alloy on a surface of a lead used as an external terminal. Nickel (Ni) crystallizes as a deposition phase in a tin-bismuth alloy structure and acts to inhibit component atoms making up the Sn-Bi alloy from migrating along a crystal grain boundary between two tin (Sn) crystal grains being adjacent to each other. Therefore, a secular change of the alloy structure of the Sn-Bi alloy used as the connection conductive layer becomes small.
|
申请公布号 |
US2003156395(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20030367699 |
申请日期 |
2003.02.19 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
OGAWA KENTA |
分类号 |
C25D7/12;C22C13/02;H01G4/228;H01L23/495;H01L23/50;H05K3/34;(IPC1-7):H01R9/00 |
主分类号 |
C25D7/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|