| 摘要 |
An object of the present invention is to provide an acceleration sensor which is inexpensive and accomplishes its small-size and light-weight structure, and a manufacturing method thereof. In order to achieve the above-mentioned object, a sensor unit (17) provided on a base (11) is sealed by a cap (13) joined to a frame portion (19) of the base (11) in an eutectic manner. The cap (13) includes a cap main body (13a) made of a semiconductor material having a conductive property and a metal film 13 provided on the circumferential edge of the cap main body (13a). The frame portion (19) includes a frame main body (19a) made of doped polysilicon, a diffusion preventive film (19b) selectively provided on the frame main body (19a), and a joining layer (19c). The joining layer has one area as a conductive portion made of a conductive material, and the other area as a joining portion made of a semiconductor. |
