Method and apparatus for processing semiconductor wafers

摘要

The apparatus includes a single bipolar electrostatic chuck (12) with a clamping surface for clamping to a wafer (14) by a force dependent on a clamping voltage applied to the chuck when the wafer is processed. A control arrangement (16,18,20) measures inherent warpage in the wafer prior to the wafer being processed on the chuck. The warpage is used to determine a minimum clamping voltage to be applied to the chuck during wafer processing.