发明名称 Intermediate board
摘要 The invention relates to an intermediate board and more particularly to a device adapting the footprint of a component to a contact arrangement of a support, e.g. a printed circuit board to which the component is to be connected. The device (3) is on one side adapted to make contact with the component (1') and on the other side adapted to make contact with the support (2). The component (1') may be a memory circuit to be connected to an electronic equipment for use in a mobile telephone and similar. The invention also relates to methods for testing components by means of the device and developing and adapting circuit boards for use with different components. <IMAGE>
申请公布号 EP1337007(A1) 申请公布日期 2003.08.20
申请号 EP20020445025 申请日期 2002.02.18
申请人 SONY ERICSSON MOBILE COMMUNICATIONS AB 发明人 BYGDOE, HAAKAN
分类号 G01R1/04;H01L23/498;H01R12/04;H01R31/06;H05K1/14;H05K3/30;H05K3/34;(IPC1-7):H01R12/22 主分类号 G01R1/04
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