| 发明名称 |
Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board |
| 摘要 |
<p>A thermosetting resin composition (a) comprising 60 to 97 % by weight of a thermosetting resin containing dihydrobenzoxazine rings and 3 to 40 % by weight of a novolac phenolic resin and a thermosetting resin composition (b) comprising 5 to 30 % by weight of the thermosetting resin and 70 to 95 % by weight of a novoiac phenolic resin are cured fast, and the cured products thereof are excellent in mechanical properties and non-flammability.</p> |
| 申请公布号 |
EP0789056(B1) |
申请公布日期 |
2003.08.20 |
| 申请号 |
EP19970300599 |
申请日期 |
1997.01.30 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
NAGASE, HIDEO;AIZAWA, TERUKI;HIRAI, YASUYUKI;SATO, YOSHIHIKO |
| 分类号 |
C08L61/06;B32B5/28;C08G14/073;C08L61/04;C08L61/20;C08L61/22;C08L61/34;H05K1/03;(IPC1-7):C08L61/34 |
主分类号 |
C08L61/06 |
| 代理机构 |
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