发明名称 Method for packaging a hygroscopic resin composition
摘要 <p>The invention relates to packaging for hygroscopic resin materials, and more particularly the invention relates to methods for packaging a hygroscopic resin composition wherein said method comprises packaging the composition into a mono-layer container comprising polypropylene resin and wherein the container has a wall thickness of between 0.25 mm and 0.6 mm. In a preferred embodiment, the composition comprises at least one resin of the group consisting of polyurethanes, polycarbonates, polyesters, and polyamides.</p>
申请公布号 EP1161385(B1) 申请公布日期 2003.08.20
申请号 EP20000913390 申请日期 2000.02.08
申请人 GENERAL ELECTRIC COMPANY 发明人 BLOM, BAS;VAN EIJK, PETER;VAN DE POEL, BARTHOLOMEUS, J., M.
分类号 B65D88/16;(IPC1-7):B65D88/16 主分类号 B65D88/16
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