发明名称 |
Method for packaging a hygroscopic resin composition |
摘要 |
<p>The invention relates to packaging for hygroscopic resin materials, and more particularly the invention relates to methods for packaging a hygroscopic resin composition wherein said method comprises packaging the composition into a mono-layer container comprising polypropylene resin and wherein the container has a wall thickness of between 0.25 mm and 0.6 mm. In a preferred embodiment, the composition comprises at least one resin of the group consisting of polyurethanes, polycarbonates, polyesters, and polyamides.</p> |
申请公布号 |
EP1161385(B1) |
申请公布日期 |
2003.08.20 |
申请号 |
EP20000913390 |
申请日期 |
2000.02.08 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
BLOM, BAS;VAN EIJK, PETER;VAN DE POEL, BARTHOLOMEUS, J., M. |
分类号 |
B65D88/16;(IPC1-7):B65D88/16 |
主分类号 |
B65D88/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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