| 摘要 |
<p>A process for implanting an electronic chip module from an electronic chip mounted on a carrier element carrying the chip, inside a data carrying card, where the chip module is permanently fixed in a special recess in the card body and where the card body and carrier elements are made from a thermoplastic. A process for implanting an electronic chip module from an electronic chip mounted on a carrier element carrying the chip inside a data carrying card, where the chip module is permanently fixed in a special recess in the card body and the card body and carrier element area made from a thermoplastic. The chip (1) is permanently fixed by friction welding, where parts (10) of the surface of the carrier element (2) and the body of the card (7) are brought into contact, and because of the repeated to and fro quick displacement of the contacting surface regions (10) and the consequent friction heat are partially melted and bonded together.</p> |
