发明名称 Method using ultraviolet radiation for integrated circuit manufacturing
摘要 A method is provided for manufacturing an integrated circuit including a substrate with a gate layer and a gate dielectric provided on the substrate. The gate layer is formed into a gate using a process that imposes a charge in the gate dielectric. The substrate, gate, and gate dielectric are irradiated to discharge the charge across the gate dielectric.
申请公布号 US6607993(B1) 申请公布日期 2003.08.19
申请号 US20020224061 申请日期 2002.08.19
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 发明人 DICKINSON RONALD;TEO YEOW MENG;QI DONG XIANG;RAJGOPAL RAJAN
分类号 H01L21/28;H01L21/768;(IPC1-7):H01L21/476;H01L21/26;H01L21/302;H01L21/44 主分类号 H01L21/28
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