Dressing apparatus and polishing apparatus

摘要

A dressing apparatus dresses a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer in a polishing apparatus. The dressing apparatus comprises a dresser having an elongate dressing surface for dressing the polishing surface, and the dressing surface has a flat surface which contacts the polishing surface. The dressing surface also has one of a tapered surface extending from the flat surface and inclined so as to be directed away from the polishing surface and a curved surface extending from the flat surface and curved so as to be directed away from the polishing surface.