发明名称 |
Semiconductor apparatus with decoupling capacitor |
摘要 |
A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power supply terminals, in which a pair of adjacent inner leads for power supply terminal and ground terminal are extended inwardly; a chip capacitor mounting pad which is provided at inner ends of the extended inner leads; and a chip capacitor which is mounted on the chip capacitor mounting pad so that a decoupling capacitor is provided.
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申请公布号 |
US6608375(B2) |
申请公布日期 |
2003.08.19 |
申请号 |
US20010827246 |
申请日期 |
2001.04.06 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TERUI MAKOTO;ANZAI NORITAKA |
分类号 |
H01L23/495;H01L23/64;H05K1/02;H05K1/18;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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