发明名称 INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To save the energy consumption during clamping a mold, in an injection molding method for filling the mold with a resin by injection and molding the resin. SOLUTION: This injection-molding device 100 is equipped with a position sensor L for measuring the mold opening level of the mold 10 and a mold clamping control device 61 having a mold clamping conditions setting machine with a capability of setting the mold 10 opening level of a mold assembly 10 during injecting a resin and filling the mold with it. First, the mold 10 with a cavity formed so as to obtain a finished product of a desired shape when the mold 10 is opened only to the predetermined mold opening level, is clamped by a first mold clamping force and filled with a resin. Next, the mold opening level is measured using the position sensor L, and when the measured mold opening level is lower than the mold opening level set in the mold clamping conditions setting machine, the first clamping force is decreased. On the contrary, when the measured mold opening level is higher than the mold opening level set in the mold clamping conditions setting machine, the first mold clamping force is increased. Thus the mold opening level after the filling of the mold 10 with a resin is controlled as described. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003231164(A) 申请公布日期 2003.08.19
申请号 JP20020029629 申请日期 2002.02.06
申请人 UBE IND LTD 发明人 OKAHARA ETSUO
分类号 B29C45/80;B29C45/70;B29C45/76;(IPC1-7):B29C45/70 主分类号 B29C45/80
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