发明名称 Cleaning efficiency improvement in a high density plasma process chamber using thermally hot gas
摘要 Method and apparatus are disclosed for improving the cleaning efficiency of a high density plasma system by introducing thermally hot gases to heat downstream chamber walls to improve the fluorine attack on deposit coatings. In certain embodiments of the invention, the cleaning gas and thermally hot gas are allowed into the region of the high vacuum pump to provide cleaning of the high vacuum pump.
申请公布号 US6606802(B2) 申请公布日期 2003.08.19
申请号 US20010998078 申请日期 2001.11.30
申请人 MICRON TECHNOLOGY INC. 发明人 SANDHU GURTEJ S.;LI MICHAEL;RUEGER NEAL R.
分类号 C23C16/44;H01J37/32;H01L21/00;(IPC1-7):F26B3/00 主分类号 C23C16/44
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