| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a double sided adhesive tape preventing damage, etc., of even an extremely thin wafer with approximately 50μm of thickness, improving operatability, and capable of carrying out a good processing to an IC chip in processing such as polishing, etc., by sticking the wafer to a support plate, capable of peeling produced IC chip without damage, and to provide a method of production for the IC chip by using the double sided adhesive tape. <P>SOLUTION: The double-sided adhesive tape contains at least one surface, a gas-evolving agent that evolves gas by stimulation. <P>COPYRIGHT: (C)2003,JPO</p> |
