METHOD OF FABRICATING PCB FOR THIN FILM MOTOR

摘要

PURPOSE: A method of fabricating a PCB(Printed Circuit Board) for thin film motor is provided to enhance the productivity and a manufacturing cost by using a plating method instead of an adhering method between copper foil and polyimide. CONSTITUTION: An insulating substrate is formed by using polyimide(1). The insulating substrate is cut into parts of a predetermined size(2). A stacked structure of the insulating substrates is formed by stacking the insulating substrates and through-holes are formed into the stacked structure(3). A plating process is performed on both sides of the stacked structure of the insulating substrates by using copper(4). A dry film is adhered on the stacked structure of the insulating substrates(5). An exposure process and a developing process are formed(6,7). A circuit is formed on the stacked structure of the insulating substrates and the dry film is separated therefrom(8). The plating process is performed on the stacked structure of the insulating substrates(9).