发明名称 Manufacturing method of semiconductor integrated circuit device
摘要 With a view to providing a technique for highly-selective etching of Ru (ruthenium) using a photoresist as an etching mask, an Ru-film, which is an lower electrode material deposited on the side walls and bottom surface of a hole, is covered with a photoresist film, followed by isotropic dry etching in a gas atmosphere containing an ozone gas, whereby a portion of the Ru film outside of the hole is removed.
申请公布号 US6607988(B2) 申请公布日期 2003.08.19
申请号 US20000749554 申请日期 2000.12.28
申请人 HITACHI, LTD. 发明人 YUNOGAMI TAKASHI;NAKAMURA YOSHITAKA;NOJIRI KAZUO;TSUNEKAWA SUKEYOSHI;ARAI TOSHIYUKI;NAKAHARA MIWAKO;OHNO SHIGERU;SAEKI TOMONORI;IZAWA MASARU
分类号 H01L21/302;C23F4/00;H01L21/02;H01L21/3065;H01L21/3213;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/302 主分类号 H01L21/302
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